summaryrefslogtreecommitdiff
path: root/Documentation/driver-api/thermal/exynos_thermal.rst
AgeCommit message (Collapse)AuthorFilesLines
2020-01-27thermal: exynos: Rename Samsung and Exynos to lowercaseKrzysztof Kozlowski1-3/+3
Fix up inconsistent usage of upper and lowercase letters in "Samsung" and "Exynos" names. "SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked names. Therefore they should be written with lowercase letters starting with capital letter. The lowercase "Exynos" name is promoted by its manufacturer Samsung Electronics Co., Ltd., in advertisement materials and on website. Although advertisement materials usually use uppercase "SAMSUNG", the lowercase version is used in all legal aspects (e.g. on Wikipedia and in privacy/legal statements on https://www.samsung.com/semiconductor/privacy-global/). Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org
2020-01-27thermal/drivers/cpu_cooling: Rename to cpufreq_coolingDaniel Lezcano1-1/+1
As we introduced the idle injection cooling device called cpuidle_cooling, let's be consistent and rename the cpu_cooling to cpufreq_cooling as this one mitigates with OPPs changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
2019-07-31docs: thermal: add it to the driver APIMauro Carvalho Chehab1-0/+90
The file contents mostly describes driver internals. Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org> Signed-off-by: Jonathan Corbet <corbet@lwn.net>