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| author | Mingcong Bai <jeffbai@aosc.io> | 2024-12-26 14:22:05 +0800 |
|---|---|---|
| committer | Greg Kroah-Hartman <gregkh@linuxfoundation.org> | 2025-01-09 13:33:32 +0100 |
| commit | 9476e599b4452152c904338662f4d5b760d46339 (patch) | |
| tree | 85b24815c6a925de22ce64d378d9c2e3ed1dec72 /security | |
| parent | 7d43ab99ac607c386c27ec91880c69ba3088a7f5 (diff) | |
| download | linux-9476e599b4452152c904338662f4d5b760d46339.tar.gz linux-9476e599b4452152c904338662f4d5b760d46339.tar.bz2 linux-9476e599b4452152c904338662f4d5b760d46339.zip | |
platform/x86: hp-wmi: mark 8A15 board for timed OMEN thermal profile
commit 032fe9b0516702599c2dd990a4703f783d5716b8 upstream.
The HP OMEN 8 (2022), corresponding to a board ID of 8A15, supports OMEN
thermal profile and requires the timed profile quirk.
Upon adding this ID to both the omen_thermal_profile_boards and
omen_timed_thermal_profile_boards, significant bump in performance can be
observed. For instance, SilverBench (https://silver.urih.com/) results
improved from ~56,000 to ~69,000, as a result of higher power draws (and
thus core frequencies) whilst under load:
Package Power:
- Before the patch: ~65W (dropping to about 55W under sustained load).
- After the patch: ~115W (dropping to about 105W under sustained load).
Core Power:
- Before: ~60W (ditto above).
- After: ~108W (ditto above).
Add 8A15 to omen_thermal_profile_boards and
omen_timed_thermal_profile_boards to improve performance.
Signed-off-by: Xi Xiao <1577912515@qq.com>
Signed-off-by: Mingcong Bai <jeffbai@aosc.io>
Link: https://lore.kernel.org/r/20241226062207.3352629-1-jeffbai@aosc.io
Reviewed-by: Ilpo Järvinen <ilpo.jarvinen@linux.intel.com>
Signed-off-by: Ilpo Järvinen <ilpo.jarvinen@linux.intel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Diffstat (limited to 'security')
0 files changed, 0 insertions, 0 deletions
