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authorMingcong Bai <jeffbai@aosc.io>2024-12-26 14:22:05 +0800
committerGreg Kroah-Hartman <gregkh@linuxfoundation.org>2025-01-09 13:33:32 +0100
commit9476e599b4452152c904338662f4d5b760d46339 (patch)
tree85b24815c6a925de22ce64d378d9c2e3ed1dec72 /security
parent7d43ab99ac607c386c27ec91880c69ba3088a7f5 (diff)
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platform/x86: hp-wmi: mark 8A15 board for timed OMEN thermal profile
commit 032fe9b0516702599c2dd990a4703f783d5716b8 upstream. The HP OMEN 8 (2022), corresponding to a board ID of 8A15, supports OMEN thermal profile and requires the timed profile quirk. Upon adding this ID to both the omen_thermal_profile_boards and omen_timed_thermal_profile_boards, significant bump in performance can be observed. For instance, SilverBench (https://silver.urih.com/) results improved from ~56,000 to ~69,000, as a result of higher power draws (and thus core frequencies) whilst under load: Package Power: - Before the patch: ~65W (dropping to about 55W under sustained load). - After the patch: ~115W (dropping to about 105W under sustained load). Core Power: - Before: ~60W (ditto above). - After: ~108W (ditto above). Add 8A15 to omen_thermal_profile_boards and omen_timed_thermal_profile_boards to improve performance. Signed-off-by: Xi Xiao <1577912515@qq.com> Signed-off-by: Mingcong Bai <jeffbai@aosc.io> Link: https://lore.kernel.org/r/20241226062207.3352629-1-jeffbai@aosc.io Reviewed-by: Ilpo Järvinen <ilpo.jarvinen@linux.intel.com> Signed-off-by: Ilpo Järvinen <ilpo.jarvinen@linux.intel.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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